BG770S-GL

BG770S-GL

BG770S-GL　Quectel Wireless Solutions Co., Ltd.

  • BG770S-GL, a 5G-ready ultra-compact LPWA module, is compliant with 3GPP Release 14, which is to support 3GPP
    Release 15–17 easily by software upgrade. The module supports LTE Cat M1/ NB2 bands, SRD* (Short Range Device)
    communication in Sub-1 GHz and 2.4 GHz bands. Besides, it features ultra-low power consumption implemented by
    Sony ALT1350 processor and integrated RAM and flash, which help reduce the current consumption to rather low
    levels in various modes, including PSM, eDRX, etc. It is further integrated with a GNSS engine that supports GPS and
    GLONASS* satellite systems.
    With an ultra-compact SMT form factor of 14.9 mm ×12.9 mm ×1.9 mm and a high integration level, the module
    enables integrators and developers to design applications easily leveraging its low power consumption and compact
    structure design.
IOT完了年月 2026年6月
Radio Access technology LTE-M
Chipset vendor / model Altair/ALT1350
IOT completed information 5G Availability NS
Supported Band NS
4G Availability S
Supported Band Band 1/3/19/28
Category Cat.M1
DL CA NS
UL CA NS
3G Availability NS
Supported Band NS
DL Category NS
UL Category NS
Function CS Voice NS
VoLTE NS
Data S
SMS S
eDRX S
eTAU S
PSM S
GPS Standalone S
Assisted
（Control Plane）		 NS
Module information Interface UART X 2 / USIM X 1 / ADC X 2 / I2C* X 1 / PCM* X 1 /
Operation Temperature Normal operating temperature : -35 °C to +75 °C
Extended operating temperature : -40 °C to +85 °C
Form Factor LGA
Dimension ※L×W×H(mm) (14.9 ±0.2) mm × (12.9 ±0.2) mm × (1.9 ±0.2) mm
Weight（g） 0.8g

Update date:2026/8

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別ウインドウが開きますQuectel Wireless Solutions Co., Ltd.
部署／担当者 Country Manager/Yasuyuki Okada
電話番号 -

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