SLM750

SLM750 MeiG Smart Technology Co., Ltd.
The SLM750 wireless module features:
- LTE Cat.4, DL/UL max: 150Mbps / 50 Mbps
- DC-HSPA+: DL 42/UL 5.76 Mbps
- Embeded IP stack with IPv4 and IPv6 support
- Dimension: 32mm*29mm*2.8mm
- Operating temperature Range -30°C to +75°
- USB 2.0,Power on&off,I2C,UART,USIM,W_Disable,LED status,Wake_up in&out,ADC,GPIO,PCM, interface
- Support Windows,Linux 2.6.21 upper,Android4.0 upper os system
- Firmware update via USB
IOT完了年月 | 2022年4月 |
---|
Radio Access technology | 4G/3G | ||
---|---|---|---|
Chipset vendor / model | Qualcomm/MDM9207 | ||
Module FW version | SLM750-V_4.2.7_EQ101 | ||
IOT completed information | 5G | Availability | NS |
Supported Band | NS | ||
4G | Availability | S | |
Supported Band | Band 1/3/19/28 | ||
Category | Cat.4 | ||
DL CA | NS | ||
UL CA | NS | ||
3G | Availability | S | |
Supported Band | Band I/VI/XIX | ||
DL Category | Cat.24 | ||
UL Category | Cat.6 | ||
Function | CS Voice | NS | |
VoLTE | NS | ||
Data | S | ||
SMS | S | ||
eDRX | NS | ||
PSM | NS | ||
GPS | Standalone | NS | |
Assisted (Control Plane) |
NS | ||
Module information | Interface | USB 2.0 x 1 / Serial x 1 | |
Operation Temperature | -40°C to +85° | ||
Form Factor | LCC | ||
Dimension ※L×W×H(mm) | 33 x 29 x 2.5 | ||
Weight(g) | 5g |
Update date:2024/11
お問い合わせ先
メーカー | |
---|---|
部署/担当者 | Testing Department/MeiG Smart Technology Co., Ltd. |
電話番号 | +86-755-83218588 |
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