JP
L860-GL-16
L860-GL-16 Fibocom Wireless Inc.
- LTE／WCDMA
- Downlink LTE FDD : 1Gbps (Cat16) & LTE TDD : 756Mbps (Cat16)
- Uplink LTE FDD : 150Mbps (Cat13) & LTE TDD : 90Mbps (Cat13)
- DL 5CA on 4 bands, DL 256QAM support & UL 2CA (Intra band) UL 64QAM
- Global Approvals
| IOT完了年月 | 2022年9月 |
|---|
| Radio Access technology | 4G/3G | ||
|---|---|---|---|
| Chipset vendor / model | Intel/M.2 7560 | ||
| Module FW version | 18601.5001.00.01.16.35 | ||
| IOT completed information | 5G | Availability | NS |
| Supported Band | NS | ||
| 4G | Availability | S | |
| Supported Band | Band 1/3/19/28/42 | ||
| Category | Cat.12 | ||
| DL CA | 4CC | ||
| UL CA | NS | ||
| 3G | Availability | S | |
| Supported Band | Band I | ||
| DL Category | Cat.24 | ||
| UL Category | Cat.6 | ||
| Function | CS Voice | NS | |
| VoLTE | NS | ||
| Data | S | ||
| SMS | S | ||
| eDRX | NS | ||
| PSM | NS | ||
| GPS | Standalone | S | |
| Assisted （Control Plane） |
NS | ||
| Module information | Interface | USIM x 1 / PCIe Gen.2 / I2C x 1 / UART x 1 (Support Smart Antenna) | |
| Operation Temperature | -10°C ～ +55°C | ||
| Form Factor | M.2 | ||
| Dimension ※L×W×H(mm) | 30mm × 42mm × 2.3mm | ||
| Weight（g） | About 6.2 g | ||
Update date:2024/11
お問い合わせ先
| メーカー | |
|---|---|
| 部署／担当者 | Asia Pacific Sales Dept. ／ Hideo Terai |
| 電話番号 | +81-80-2460-5707 |
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