JP
FG360-JP
FG360-JP Fibocom Wireless Inc.
- Small ,Slim LGA form factor (41x44x2.75mm)
- High speed data module, support 5G NR Sub6 SA/NSA, LTE Cat19 & 3G fallback
- Rx diversity for 3G/4G/5G, up to 4x4 DL-MIMO & 2x2 UL-MIMO
- GNSS support (GPS, GLONASS, BeiDou, Galileo, QZSS)
- High power and low cost
- For Japan FWA Market
*IOT for SA not performed
| IOT完了年月 | 2022年4月 |
|---|
| Radio Access technology | 5G/4G/3G | ||
|---|---|---|---|
| Chipset vendor / model | MediaTek/MT6890 | ||
| Module FW version | 81102.7000.00.06.01.42 | ||
| IOT completed information | 5G | Availability | S |
| Supported Band | Band n78/n79 | ||
| 4G | Availability | S | |
| Supported Band | Band 1/3/19/28/42 | ||
| Category | Cat.12 | ||
| DL CA | 5CC | ||
| UL CA | 2CC | ||
| 3G | Availability | S | |
| Supported Band | BandⅠ | ||
| DL Category | Cat.24 | ||
| UL Category | Cat.7 | ||
| Function | CS Voice | NS | |
| VoLTE | NS | ||
| Data | S | ||
| SMS | S | ||
| eDRX | NS | ||
| PSM | NS | ||
| GPS | Standalone | S | |
| Assisted （Control Plane） |
NS | ||
| Module information | Interface | PCIe Gen3 X1 / USB 3.1 | |
| Operation Temperature | -30°C ～ +75°C | ||
| Form Factor | LGA | ||
| Dimension ※L×W×H(mm) | 41mm × 44mm × 2.75mm | ||
| Weight（g） | ~11g | ||
Update date:2024/11
お問い合わせ先
| メーカー | |
|---|---|
| 部署／担当者 | Asia Pacific Sales Dept. Hideo Terai |
| 電話番号 | +81-80-2460-5707 |
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