JP
EG91-JP
EG91-JP Quectel Wireless Solutions Co., Ltd.
- Cost-effective and low-power LTE connectivity optimized for broadband IoT applications
Compact SMT form factor ideal for size-constrained applications with extended operation temperature range
Embedded power management unit (PMU) featuring ultra-low deep-sleep current consumption
Operating Temperature -35 °C to +75 °C
Extended Temperature -40 °C to +85 °C
| IOT完了年月 | 2023年9月 |
|---|
| Radio Access technology | 4G | ||
|---|---|---|---|
| Chipset vendor / model | Qualcomm/MDM9x07 | ||
| Module FW version | EG91JPGAR08A05M1G | ||
| IOT completed information | 5G | Availability | NS |
| Supported Band | NS | ||
| 4G | Availability | S | |
| Supported Band | FDD:B1/ B3/ B8/ B18/ B19/ B26 | ||
| Category | Cat.1 | ||
| DL CA | NS | ||
| UL CA | NS | ||
| 3G | Availability | NS | |
| Supported Band | NS | ||
| DL Category | NS | ||
| UL Category | NS | ||
| Function | CS Voice | S | |
| VoLTE | S | ||
| Data | S | ||
| SMS | S | ||
| eDRX | NS | ||
| PSM | NS | ||
| GPS | Standalone | S | |
| Assisted （Control Plane） |
S | ||
| Module information | Interface | USB 2.0 x 1 | |
| Operation Temperature | -35 °C to +75 °C | ||
| Form Factor | LGA | ||
| Dimension ※L×W×H(mm) | 29.0 × 25.0 × 2.45 | ||
| Weight（g） | Approx. 4.2 g | ||
Update date:2024/11
お問い合わせ先
| メーカー | |
|---|---|
| 部署／担当者 | Regional Sales Director / Keith Ito |
| 電話番号 | +81-90 6112 0388 |
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